MicroSense LLC
Wafer measurement systems from MicroSense offer precise, automated geometry measurements including Thickness, TTV, BOW, WARP, LTV, and 3D mapping on a wide range of substrates including Sapphire, Silicon and SiC.
Wafer measurement systems from MicroSense offer precise, automated geometry measurements including Thickness, TTV, BOW, WARP, LTV, and 3D mapping on a wide range of substrates including Sapphire, Silicon and SiC.